EM-5434M stepper is designed to enable a lithography process in the production of PCBs (IC Substrate) for flip-chip packaging (BGA/CSP). The universality of the tool lies in capability to work with thick photoresist (50µm) and to control the resist side wall angle.

EМ-5534 stepper aligns and enables the projection transfer of the reticle image in 1:1 ratio onto the photoresist coated wafer and the further step-and-repeat imaging over the entire wafer. EМ-5534 stepper is designed to enable the lithography process in thick (up to 200 μm) photoresist layers. It can be employed in semiconductor die solder and gold bumping processes, as well as in photolithography processes for MEMS.

EМ-5634 CCD stepper is designed to enable photolithography processes in the production of super large matrix and linear CCDs. The main feature of EМ-5634 is a large working field of the projection lens (50x50 and 35x100) mm with high resolution of 1 µm