Automated station for E-Beam evaporation of high-quality thin-film compositions in UHV The System was designed in accordance with “lab to fab” approach and is intended for both intensive R&D activities and pilot production. The system design enables to integrate it into multipurpose UHV cluster process line. Maximum quantity of wafers in one process is: 3х3” or 6х2”. Wafers are installed on a spherical-profile holder, considering specific features of “lift-off” process.

New versatile System for magnetron and thermo resistance sputtering for batch wafer processing STE MS900 System allows to sputter multicomponent layers (metals, resistant layers etc.) on the substrate heated up to 500°C. System is designed for both active R&D and small­scale production. Maximum number of sputtering substrates in the same process: 150 mm – 6 pcs. Targets with diameter of 6’’ ensure uniformity of ±2% for 100 mm. Magnetic mount makes targets replacement very easy.

System for high-temperature treatment of semiconductor wafers in controlled gas, vacuum, oxidizingor deoxidizing atmosphere Special design of aluminum chamber allows carrying out thermal annealing at extremely high temperatures (up to 1300°С) in combination with long annealing time (up to 60 min). This system can be used both for R&D activities and for pilot production. Maximum diameter of wafers is 150 mm.