Designed to extract metals from wastewater (waste electrolytes and wash water). The unit can operate both independently and as part of a galvanic line. Applicable in all electroplating processes.

Designed to produce clean water in the electroplating industry, in the production of printed circuit boards. The principle of operation of the installation is based on reverse osmosis and mechanical filtration. The installation is equipped with auxiliary tanks and water quality control devices.

Designed to supply electroplating baths with direct current of positive and negative polarity, rectangular pulses, periodic current of a given shape. The units have a block-modular design and are produced in a desktop version with a nominal amplitude current of 10 (20; 50; 100) A, respectively.

The rectifying unit, based on high-frequency energy conversion, is used in the composition of electroplating lines for the processes: gilding, silvering, platinirovanie, palladium - galvanic coatings with precious metals; copper plating, nickel plating, tin-bismuth, galvanizing, cadmium plating - galvanic coatings of functional metals; anodizing of aluminum and other consumers of stabilized current.

Designed for pumping corrosive and neutral liquids with a density of not more than 1200 kg / m and temperatures from +7 to + 60 ° С, not containing solid magnetic particles. The pumpless design eliminates leakage of the pumped liquid and its contact with chemically unstable materials.

The installation is intended for the manifestation of negative photoresist on the substrate by centrifuging. Installation can be used independently and as part of the line. The unit is manufactured in climatic version UHL 4.1 according to GOST 15150-69. The unit is powered from an AC mains with a voltage of 220V and a frequency of 50 Hz. The requirement for the quality of electrical energy according to GOST 13109-87. The installation provides operation when compressed air is supplied in accordance with GOST 17433 under pressure of 3 * 105 Pa, 3kgs / cm2. Requires a drain outlet device in the sewer.

The installation is intended for the development of positive photoresist on the substrate by centrifuging. Installation can be used independently and as part of the line. The unit is manufactured in climatic version UHL 4.1 according to GOST 15150-69. The unit is powered from an AC mains with a voltage of 220V and a frequency of 50 Hz. The requirement for the quality of electrical energy according to GOST 13109-87. The installation provides operation when compressed air is supplied in accordance with GOST 17433 under pressure of 3 * 105 Pa, 3kgs / cm2.

The installation is intended for applying a positive photoresist on a substrate by centrifuging. Installation can be used independently and as part of the line. The unit is manufactured in climatic version UHL 4.1 according to GOST 15150-69. The unit is powered from an AC mains with a voltage of 220V and a frequency of 50 Hz. The requirement for the quality of electrical energy according to GOST 13109-87. The installation provides operation when compressed air is supplied in accordance with GOST 17433 under pressure of 3 * 105 Pa, 3kgs / cm2.

The installation is intended for applying a negative photoresist on a substrate by centrifuging. Installation can be used independently and as part of the line. The unit is manufactured in climatic version UHL 4.1 according to GOST 15150-69. The unit is powered from an AC mains with a voltage of 220V and a frequency of 50 Hz. The requirement for the quality of electrical energy according to GOST 13109-87. The installation provides operation when compressed air is supplied in accordance with GOST 17433 under pressure of 3 * 105 Pa, 3kgs / cm2.

A set of equipment for the techno-chemical processing of substrates in the production of microstrip boards consisting of: Gold chemical deposition line; Copper surface preparation line before applying photoresist on conductor layers and before gilding; Pickling line resistive layers; Line of chemical preparation of substrates before deposition of resistive and conductive layers; Line preliminary chemical preparation of substrates before spraying.