集成電路外殼
提供者: Ruselectronics (俄罗斯电子)
中小功率集成電路外殼
Package type – 8-lead Glass-to-Metal Flatpack Package KUYAL
Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2102.14-10
Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2103.16-22
Hermetic SMD Package – КТ-93-2 (SMD-0.5)
Technochemical equipment for semiconductor production