The installation is designed for mounting crystals on glue in small-scale production conditions and allows for automatic operation of capturing, planting and applying adhesive compositions with a given geometric pattern (line, cross, star, spriral, etc.).

The semiautomatic device for the installation of UPM-1000-1М components is intended for planting surface-mounted components on a printed circuit board under conditions of pilot and small-scale production. The installation process is controlled by special software that clearly displays the sequence of the assembly process of the printed circuit board and minimizes the possibility of operator error. The exact place of landing of the component is indicated by a motorized catch of the vacuum tweezers, and the place of capture is indicated by an LED indicator. In the process of working on the monitor screen, the virtual assembly of the printed circuit board is carried out with the image of the real component housings with indication of their polarity.