GLOBALFOUNDRIES’ technology platforms from 130nm to 22nm offer a wide variety of embedded memory solutions to address the emerging markets. These include embedded magneto-resistive RAM (eMRAM), embedded Flash (eFlash) and System In Package (SIP Flash) to address the requirements of broad market segments.

GLOBALFOUNDRIES’ eMRAM offering, with its low power consumption, makes it ideal for the MCU and IoT markets, and its fast access speed and high memory capacity makes it suitable for compute and storage markets. eFlash solutions, along with RF and analog enablement and comprehensive IP, are optimized for specific applications such as wearables, IoT, automotive, industrial, and consumer. SIP Flash is a flexible and cost-effective package based solution for low cost, high capacity memory requirements and delivers the fastest time to market.

High-reliability and AEC-Q100 automotive grade 1 MCUs
Industrial MCUs, IoT-gateways and smartcards
IoT, wearables, smart devices and sensor hubs
Integration of wireless connectivity with MCU (55nm LPx)
Integration of analog functions with MCU (130nm BCDLite®)
Other memory solutions include eFuse, EEPROM, OTP and MTP design-ready solutions with silicon validation