Installation FK-220 is designed to create a uniform gap between the crystals of the cut semiconductor wafer by uniformly stretching the film carrier in all directions. The implementation of this operation provides the following benefits:

Improving the efficiency of washing plates / substrates after disk cutting

Simplification of the process of removing crystals / elements from film carrier

The absence of chips on the edges of the crystals formed during their removal from the film carrier, since neighboring crystals do not touch each other

The stretching of the film on the FK-220 installation is performed as follows: the inner ring of the hoop is installed on the heated table, the outer ring of the hoop is installed in the cover, the cut plate fixed on the frame with the film carrier is installed between the table and the cover. At the operator's command, the table begins to rise, stretching the film and closing the inner and outer rings of the hoop. Thus, the stretched film with crystals is fixed in the hoop.

The installation produces heating of the film to increase its elasticity under tension. Other adjustable process parameters include the length of the table stroke, which affects the amount of stretching of the film, as well as the stroke speed.

Specifications:

Diameter of the processed plates, no more, mm 200

The course of the desktop, 25-75 mm

Desktop heating temperature, not more, оС 70

Power supply, V 220

with current frequency, Hz 50

Power consumption, not more, W 150

Overall dimensions, not more than, mm 540x380x180

Weight, no more, kg 50