Description:
The Side Braze package, commonly known as a "DIP", consists of two rows of leads brazed onto the sides of the ceramic base; The quantity of pins - 16 ; Pin pitch - 2,5mm; Through-hole package (Plug-Ins); The bottom and the walls of these packages constructed of high temperature coffered ceramic; Die bonding – eutectic or adhesive; The basic method of hermetic sealing - parallel seam welding; The DIP is widely used due to its reliability, high performance, and ease of use. They can be mounted on a PC board with socket, manual or automated equipment.