Description

JSC Concern Sozvezdiye
About the product
DESCRIPTION
- The maximum number of layers-16, at the stage of working out 24 layers;
- Minimum conductor width / gap on outer layer-0.1/0.1 mm;
– The minimum width of the conductors on the inner layer is 0.075 mm;
- Minimum diameter of through transition holes-0,2 mm at the ratio of Board thickness to hole
diameter-10:1;
- Diameter of "blind" holes-0,3...0,15 mm at the ratio of depth to diameter of a hole-0,8 :1;
– Metallization of the end faces and grooves;
- The maximum thickness of the WFP - 6 mm;
- The minimum thickness of the WFP layer is 0.1 mm;
- Base workpiece size 457 x 305 mm;
- Circuit coating-immersion gold and OS 61 with reflow;
- Liquid photo-proofing solder mask;
- Base materials FR4, RO 4003, RO 4350;
- WFP rectangular and round shape;
- Manufacture of multilayer printed circuit boards 4-5 accuracy class with elements of 6 accuracy class: