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Industrial module MR-BT1
The MR-BT1 module is distinguished by its industrial design, which makes it possible to use it as a basis for devices operated in harsh environments and with increased security requirements. The industrial design of the module consists in its increased resistance to mechanical and climatic influences, including: vibration, shock, high / low temperature, and increased air humidity.
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T-PlatformsDescription
MIPS Architecture (Baikal-T)
Processor: “Baikal-T1”, 1.2 GHz, 2 P5600 cores, MIPS architecture
Level 2 cache: 1 MB L2
RAM: 4 GB DDR3-1600
GbE: x 2
PCIe Gen.3 x4: × 1
SATA 3.0: × 2
SD Card: × 1
USB 2.0 Host: × 1
SPI Master x4CS: x 1
UART: x 2
I2C Master: x 2
GPIO: x 10
OS: Compatible with Linux Debian 8
Power Format: 3.3 B
Power consumption: Not more than 15 W
Dimensions: WxD 60 × 60 mm, board thickness 2 mm, module thickness 13.75 mm
Weight: 30 g
Connector on the carrier board: Hirose FX6-80S-0.8SV2
Processor: “Baikal-T1”, 1.2 GHz, 2 P5600 cores, MIPS architecture
Level 2 cache: 1 MB L2
RAM: 4 GB DDR3-1600
GbE: x 2
PCIe Gen.3 x4: × 1
SATA 3.0: × 2
SD Card: × 1
USB 2.0 Host: × 1
SPI Master x4CS: x 1
UART: x 2
I2C Master: x 2
GPIO: x 10
OS: Compatible with Linux Debian 8
Power Format: 3.3 B
Power consumption: Not more than 15 W
Dimensions: WxD 60 × 60 mm, board thickness 2 mm, module thickness 13.75 mm
Weight: 30 g
Connector on the carrier board: Hirose FX6-80S-0.8SV2